Near-Field Antenna & Metamaterials Characterization

Anechoic Chamber

• Fully automated planar/cylindrical/spherical near-field scanner up to 40GHz
• Designed by Nearfield Systems
• 5'×5' XY-scanning range
• 5'×360° cylindrical scanning range
• 180°×360° cylindrical scanning range
• Z-translation:
• 5' + additional 10" on AUT side
• 4" on probe side
• 360° probe rotation around Z
• Fully customizable fixtures on AUT side
• 8-axis antenna range controllers
• Wired remote control
• Fully programmable/scriptable software GUI control of RF equipment, positioners, and processing functions
• Request to use equipment

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Near-Field Scanner

• Fully automated planar/cylindrical/spherical near-field scanner up to 40GHz
• Designed by Nearfield Systems
• 5'×5' XY-scanning range
• 5'×360° cylindrical scanning range
• 180°×360° cylindrical scanning range
• Z-translation:
• 5' + additional 10" on AUT side
• 4" on probe side
• 360° probe rotation around Z
• Fully customizable fixtures on AUT side
• 8-axis antenna range controllers
• Wired remote control
• Fully programmable/scriptable software GUI control of RF equipment, positioners, and processing functions
• Request to use equipment

Laser-Based Rapid PCB Prototyping

• LPKF ProtoMat D104
• Combination UV-laser etching (for sub-100um features) and mechanical drilling/routing/cutting/surface milling
• Laser: 349nm (UV) 100mW, max. 15um diameter (focused), 3um resolution, 1um repeatability
• Mechanical: max. 100,000rpm (variable), hole drilling at 100 holes/min.
• 9"×12"×0.4" work area
• 50um traces with 30um spacing or better on rigid/woven materials, PTFE based substrates, and unfired LTCC substrates
• Fiducial alignment camera for double-sided PCBs
• LPKF CircuitPro 2.3 software
• Request to use equipment

High Performance Probe System

Summit™ series manual and semi-automated probe systems, with PureLine™ and AttoGuard® technology, allow you to access the full range of your test instruments for 200 mm and 150 mm wafers. Whatever your application: RF/Microwave, device characterization, wafer level reliability, e-test, modeling, or yield enhancement, Summit series platforms lead the industry in onwafer measurements. Summit series probe stations are easy to configure with your choice of measurement performance, manual or semi-automated operation, chuck size, thermal range and microscope options. All platforms are -60°C to 300°C compatible to ensure an upgrade path to meet your future needs [1].

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[1] For more info., you can refer to the following link.

3D Printing Facility

Details: This is a details of the 3D printer capablity ...