The nanoFAB is a centralized, open access research and development facility specializing in micro and nano scale fabrication and characterization. Through the support of the Faculty of Science, the nanoFAB manages over 180 individual tools, a 5,000 sq ft class 10 cleanroom, and specialized anti-vibration lab space as the largest academic facility in Canada dedicated to characterization and fabrication at the nano scale. As an open access facility, the nanoFAB is committed to supporting academic and industrial innovation from design through characterization, supporting the transitioning of ideas from academic research groups and industry into real-world innovations and prototypes. The facility provides undergraduate/graduate student training, fee for services and technical research support on $85M in specialized equipment and infrastructure including a comprehensive suite of over 180 tools for nano-science and engineering.
For more information please visit nanoFAB: Fabrication & Characterization Facility
Available Equipment and Assays:
For a complete list of available Equipment, visit the nanoFAB website
Alpha Step IQ, Alphastep 250 Profilometer (10K Lab), Atomic Force Microscope ( Dimension Edge), Auger Microprobe (JAMP-9500F, JEOL), Autosorb iQ, Autosorb Quantachrome 1MP, Blue M Oven, Branson 3000 Barrel Etcher, Brewer Spinner and Hotplate, CEE Hotplate, Cold plate (Stir-Kool SK-12D), Contact Angle Measurement system (First 10 Angtroms), Critical Dimension measurement system (Mircometrix), Critical Point Drier, Denton Gold Sputter Unit (for SEM), Dicing Saw (Disco DAD 321), Differential Scanning Calorimeter (DSC), Electron beam evaporation system #1 (Gomez), Electron beam evaporation system #2 (Homer), Ellipsometer (M-2000V), Embosser & Nanoindenter (Jenoptik HEX02), FACS Flow Cytometer, Filmetrics Resist and Dielectric Thickness Mapping System, Filmetrics Thickness Monitor (F10-VC) (A), Filmetrics Thickness Monitor (F10-VC) (B), Flexus Wafer Stress measurement system, Four point Probe, Four Point Probe (Pro4 4000) (A), Four Point Probe (Pro4 4000) (B), Fumehood (Aisle 2 - KOH/TMAH), Fumehood (Aisle 1 - Headway Spinner/Hotplate), Fumehood (Aisle 3 - General Use), Glass Bonding Area, GPC Agilent 1200, Helium Ion Microscope (Zeiss Orion NanoFAB w/ Ga FIB), HPLC-UV Agilent 1200, ICPRIE (Alcatel AMS110), ICPRIE (Oxford Instruments), ICPRIE (STS), Industrial L-Edit, Inpsection Microscope (Leitz Ergolux in 10K lab), Inspection Microscope (Leica MS5 in 10K lab), Inspection Microscope (Leitz Ergolux in 1K lab), LEDIT on two computer systems, Leica INM 100 Optical Microscope with confocal and UV imaging, Leica INM-100 Optical Microscope with Flourescence Imaging, Litho Wetdeck #1, Litho Wetdeck #2, Lithography Process Station 1, Lithography Process Station 2, LPCVD Boron Doped PolySi Deposition, LPCVD Doped Anneal, LPCVD General Anneal, LPCVD Nitride Deposition, LPCVD PolySi Deposition, MALDI TOF/TOF AB Sciex 4800, Mask Aligner (IR through-wafer) (Bert - MA#1), Mask Aligner (UV / DUV)(Elmo - MA#2), Mask Cleaning Station, Minibrute Bottom Furnace (Boron Doping), Minibrute Middle Furnace (Thermal oxide and General annealing), Minibrute Top Furnace (Thermal oxide and General annealing), Muffle Furnace, Muffle Furnace (For PZT only!), NanoIndenter (Hysitron TI 900), Nanometrics Hall Measurement (HL5500), NanoWizard II AFM (JPK), Olympus Confocal Microscope (FV10i), Organics evaporator (PVD-75), Parameter Analyzer - Keithley 4200 SCS, Parylene Deposition System, Pattern Generator (Heidelberg DWL-200), Pattern Generator Compile software on one computer system, PDMS Process area, PECVD (Trion), Peptide Synthesiser (AB 433A), Photomask Processing Station, Polisher (Beuhler), Probe Station (Wentworth), Probe Station with advanced setup (Wentworth), Profilometer (Tencor P-6), QTrap LC/MS/MS AB Sciex 4000, Raith 150 EBL System, Raith 150-two, Raith EBL software on two computer systems, RIE (STS), RIE (Trion), RIE (uEtch), Rigaku XRD Ultimate IV, Savant SuperModulyo Freeze Dryer, Scanning Electron Microscope (Tescan Vega-3 w/ EDX), Scanning Electron Microscope (TM-1000), Scanning Electron Microscope (Zeiss EVO MA10), Scanning Electron Microscope (Zeiss Sigma FESEM w/ EDX & EBSD), Scriber, Solitec Spinner #1, Solitec Spinner #2, Solitec Vacuum Hotplate, Spectrophotometer (Perkin-Elmer NIR-UV), Spectrophotometer UV/VIS (Hitachi U-3900H), Speedvac Concentrator, Spin Rinse Drier (10K Lab), Spin Rinse Drier (Wet aisle #1), Spin Rinse Drier (Wet aisle #2), Sputtering System #1 (Bob), Sputtering System #2 (Doug), Sputtering System #3 (Floyd), SUSS bonder, Teflon AF Processing, Thermal Gravimetric Analyzer (TGA), Thin Film Stress Measurement (FLX 2320), TOF-SIMS Imaging Spectrometer (ION-TOF GmbH), Upright Microscope (LV150), UV / Ozone Bonder, UV/VIS Spectrophotometer (U-3900H), UV/VIS Spectrophotometer (U-3900H), Vacuum Ovens (X3), VASE Ellipsometer, Wet Process - General Use - DD Aisle#1, Wet Process - General Use - DD Aisle#2, Wet Process - General Use - WD Aisle#1, Wet Process - HF/BOE - DD Aisle#1, Wet Process - HF/BOE - DD Aisle#2, Wet Process - Metal Etch - DD Aisle#1, Wet Process - Metal Etch - DD Aisle#2, Wet Process - Metal Etch - WD Aisle#1, Wet Process - Piranha - WD Aisle#2, Wirebonder (K & S), XeF2 Etching System, XPS Imaging Spectrometer (Kratos AXIS Ultra), XPS Spectrometer (Kratos AXIS 165), YES HMDS Oven, Zygo Optical Profilometer, nanoFAB: Fabrication & Characterization Facility